DBC Ceramic Substrate DBC(Direct Bond Copper) Substrate are used a special process in which the copper foil and the Al2O3 are directly bonded under appropriate high temperature, which applications are power semiconductor modules, thermoelectric cooling modules, electronic heating devices, power control circuits, power hybrid circuit. Benefits High mechanical strength,mechanicallly stable shape Better thermal cycling capabilities, high reliability. Environmentally friendly[...]

Thick Film Ceramic Tube for Load switch vacuum switch Metallized thick film Ceramic Tube for Load switch vacuum switch Metallized Ceramics Applications: Feed-through insulators, Headers, High-power receptacles, Insulating discs, Insulator rings and cylinders, Precipitator products, Power switches, Traveling wave tubes, Vacuum interrupters, Windows, Power grid tubes, X-ray tubes Joining types: Ceramic + Mo/Mn Metallized + plating Ni Ceramic + Mo/Mn Metallized + plating Ag Ceramic[...]

Thin Film Ceramics Microcircuits ELE Advanced Ceramics specialises in the manufacture of miniature components and microcircuits for mounting of semiconductor devices. Our in-house capabilities include thin-film, thick-film and refractory metallising of ceramics and metals, electroplating, laser machining and marking, precision dicing, atmosphere/vacuum brazing and solder assembly. Contact Technical Sales for further details.[...]

Thin Film Ceramics Resistors Applications Amplifiers, Couplers, Attenuators, Filters and any other application in MIC assemblies Features Tantalum nitride thin film Alumina substrate Low stray Capacitance Excellent solderability and bonding Operating Temp Range: -55°C to +125°C Temperature Coefficient: ±150ppm/°C[...]